|
EN
|
DE
|
R. Niemeier, B. Büttner (Dynardo GmbH)
Solder Joint Reliability, Uncertainty Quantification and Probability of Failures of eWLB Radar Packages
7th European Expert Workshop on Reliability of Electronics and Smart Systems, Berlin 2019
|
|
|
Martin Niessner (Infineon Technologies AG)
Controlling the solder joint reliability of eWLB packages in automotive RADAR applications using a design for reliability approach
16th Weimar Optimization and Stochastic Days 2019
|
|
|
Dipl.- Math.techn. Konrad Riester (Robert Bosch GmbH)
Creation of a field meta model on the basis of electro-thermal-mechanical FEM simulations
15th Weimar Optimization and Stochastic Days 2018
|
|
|
Dr. Arnab Biswas (Infineon Technologies AG)
Computer-Aided Calibration of IGBT SPICE model with optiSLang tool
15th Weimar Optimization and Stochastic Days 2018
|
|
|
St. Kunath, V. Bayer, R. Niemeier (DYNARDO GmbH)
Predictive reliability with signal based meta-models
EuroSimE, Dresden 2017
|
|
|
S. Tandon, E Liu, G. Elger (Technische Hochschule Ingolstadt), Th. Zahner, S. Besold, W. Kalb (OSRAM Opto Semiconductors GmbH)
Transient Thermal Simulation of High Power LED and its Challenges
EuroSimE 2017
|
|
|
Infineon Technologies AG
Optimization of signal extraction to analyze complex material models in the semiconductor industry
RDO-Journal 2_2015
|
|
|
C. Faust-Ellsässer (Robert Bosch GmbH)
Geometrische Zuverlässigkeitsoptimierung der Aufbau- und Verbindungstechnik in der Leistungselektronik
10. Weimarer Optimierungs- und Stochastiktage 2013
|
|
|
Axel Müller, Sven Rzepka (Qimonda)
Optimization of visco-elastic material models of mold compounds used for electronic packages based on evolutionary algorithms
4. Weimarer Optimierungs- und Stochastiktage 2007
|
|
|
Robert Bosch GmbH
Investigation of interface delamination in molded power modules
4. Weimarer Optimierungs- und Stochastiktage 2007
|
|
|