Semi conductor industry
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R. Niemeier, B. Büttner (Dynardo GmbH) Solder Joint Reliability, Uncertainty Quantification and Probability of Failures of eWLB Radar Packages 7th European Expert Workshop on Reliability of Electronics and Smart Systems, Berlin 2019 |
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Martin Niessner (Infineon Technologies AG) Controlling the solder joint reliability of eWLB packages in automotive RADAR applications using a design for reliability approach 16th Weimar Optimization and Stochastic Days 2019 |
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Dipl.- Math.techn. Konrad Riester (Robert Bosch GmbH) Creation of a field meta model on the basis of electro-thermal-mechanical FEM simulations 15th Weimar Optimization and Stochastic Days 2018 |
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Dr. Arnab Biswas (Infineon Technologies AG) Computer-Aided Calibration of IGBT SPICE model with optiSLang tool 15th Weimar Optimization and Stochastic Days 2018 |
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St. Kunath, V. Bayer, R. Niemeier (DYNARDO GmbH) Predictive reliability with signal based meta-models EuroSimE, Dresden 2017 |
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S. Tandon, E Liu, G. Elger (Technische Hochschule Ingolstadt), Th. Zahner, S. Besold, W. Kalb (OSRAM Opto Semiconductors GmbH) Transient Thermal Simulation of High Power LED and its Challenges EuroSimE 2017 |
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Infineon Technologies AG Optimization of signal extraction to analyze complex material models in the semiconductor industry RDO-Journal 2_2015 |
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Axel Müller, Sven Rzepka (Qimonda) Optimization of visco-elastic material models of mold compounds used for electronic packages based on evolutionary algorithms 4. Weimarer Optimierungs- und Stochastiktage 2007 |
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Robert Bosch GmbH Investigation of interface delamination in molded power modules 4. Weimarer Optimierungs- und Stochastiktage 2007 |
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